Microchip Technology 28LV64AF-30/SO Mfr Package Description: PLASTIC, SOIC-28 Technology: CMOS Package Shape: RECTANGULAR Package Style: SMALL OUTLINE Surface Mount: Yes Terminal Form: GULL WING Terminal Position: DUAL Number of Functions: 1 Number of Terminals: 28 Package Body Material: PLASTIC/EPOXY Temperature Grade: COMMERCIAL Memory Width: 8 Organization: 8K X 8 Memory Density: 65536 deg Operating Mode: ASYNCHRONOUS Number of Words: 8192 words Number of Words Code: 8K Operating Temperature-Max: 70 Cel Operating Temperature-Min: 0.0 Cel Supply Voltage-Max (Vsup): 3.6 V Supply Voltage-Min (Vsup): 2.7 V Supply Voltage-Nom (Vsup): 3.3 V Memory IC Type: EEPROM 3V Parallel/Serial: PARALLEL Access Time-Max (tACC): 300 ns